This new 135,000 SF tilt-up concrete building in Chandler, Arizona includes a 35,000 SF mezzanine structure, a Class A corporate office area, and 60,000 SF of general offices. The project includes a clean manufacturing assembly area and internal cranes along with Class 100, Class 1,000 and Class 10,000 cleanrooms for manufacturing; process piping; equipment; and related systems integration. SpeedFam manufactures products related to chemical mechanical planarization (CMP) technology. CMP is a process used in semiconductor manufacturing to polish and planarize the surfaces of wafers, ensuring the uniformity and smoothness necessary for the fabrication of integrated circuits.